Metal precursors for semiconductor applications

ABSTRACT

Methods and compositions for depositing metal films are disclosed herein. In general, the disclosed methods utilize precursor compounds comprising gold, silver, or copper. More specifically, the disclosed precursor compounds utilize pentadienyl ligands coupled to a metal to increase thermal stability. Furthermore, methods of depositing copper, gold, or silver are disclosed in conjunction with use of other precursors to deposit metal films. The methods and compositions may be used in a variety of deposition processes.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application claims the benefit of U.S. ProvisionalApplication Ser. No. 60/939,271, filed May 21, 2007, herein incorporatedby reference in its entirety for all purposes.

BACKGROUND

1. Field of the Invention

This invention relates generally to the field of semiconductorfabrication. More specifically, the invention relates to new precursorsfor deposition of metal films on to substrates.

2. Background of the Invention

ALD and CVD are particularly useful techniques for deposition of metalfilms as compared to other methods of deposition such as physical vapordeposition (PVD) methods like sputtering, molecular beam epitaxy, andion beam implantation. ALD and CVD can also be used to provideflexibility in the design of manufacturing electronic devices includingthe potential to reduce the number of processing phases required toprovide a desired product. These techniques allow conformal deposition,selective deposition for the deposition of copper, silver, gold andother materials. Suitable processes to form metal films require theidentification of relevant precursors requiring strict requirements suchas being thermally stable, easily vaporized, reactive, with cleandecomposition.

The need for high performance interconnection materials increases asdevice feature sizes shrink and device density increases. Copperprovides an alternative to CVD of aluminum in ultra large scaleintegrated (ULSI) devices due to its low resistivity (1.67 μΩcm for Cu,2.65 μΩcm for Al), high electromigration resistance and high meltingpoint (1083° C. for Cu, 660° C. for Al). Its low interconnectresistivity also may allow for faster devices.

Copper precursors are quite volatile and show low depositiontemperatures, but are highly, sensitive to heat and oxygen. The latterprecursors are rather stable, but are isolated as solids with highmelting points and thus require high deposition temperatures. It iscommon for impurities such as carbon or oxygen to be incorporated duringthe thermal CVD process when using certain organometallic precursors.For instance, (η 5-C 5H 5)Cu(PMe3) produces copper films leading toincorporation of phosphorus. Moreover, phosphine-containing moleculesare disqualified because of their high toxicity. Organic phosphines arevery hazardous and PF3 being both hazardous and might lead to undesiredphosphorus contamination and fluorine-induced etching/damage. Suchchemicals might therefore be subject to strict regulations.

An example of an existing copper precursor includes(1,1,1,5,5,5-hexafluoro-2,4-pentanedionate)CuL ((hfac)CuL), where L is aLewis base. These types of precursors have been the most studied copperprecursors to date because they can 1,5 deposit copper via a thermaldisproportionation reaction. Especially(1,1,1,5,5,5-hexafluoro-2,4-pentanedionate)Cu(trimethylvinylsilane),which has attracted much attention because it is a liquid withreasonably high vapor pressure. Other copper compounds such as(1,1,1,5,5,5-hexafluoro-2,4-pentanedionate)CuL, where L is1,5-cyclooctadiene (CUD), alkyne or trialkylphosphine, are either solidsor liquids with a low vapor pressure. Although(hfac)Cu(trimethylvinylsilane) ((hfac)Cu(tmvs)) has been the mostutilized copper precursor, its stability is not satisfactory for theselective growth of copper films with reproducibility. In addition,studies have demonstrated that the chemical vapor deposition reaction of(hfac)Cu(tmvs) under ultra high vacuum conditions produced contaminationby carbon and fluorine in the deposited films. Therefore, a precursorwith high volatility and stability, which contains no fluorinatedligands, is more desirable for the deposition of copper by CVD.

Copper compounds of acetoacetate derivatives which contain nofluorinated ligands have been previously used as CVD precursors.Although these compounds were reported to be volatile and capable ofdepositing copper films at low substrate temperatures. The studiedacetoacetate derivatives were found to be attractive since they werevolatile without employing fluorinated ligands and deposited copperfilms at temperatures below 200° C. However, these derivatives are solidwith high melting points and are incapable of selective deposition ofcopper. On the other hand, the Cu(I) acetoacetate derivatives depositedcopper films at relatively low temperatures via disproportionationreaction. However, few are practical for use as CVD precursors sincethey are either solids or liquids with a low vapor pressure or they havean extremely low thermal stability (i.e. their decomposition temperatureis within a few degrees of their vaporization temperature).

Consequently, there is a need for organometallic precursors to depositmetal film without decomposition of the ligands and without associatedtoxic by products.

BRIEF SUMMARY

New precursor compositions for metal film deposition are disclosedherein. In general, the disclosed compositions utilize precursorcompounds comprising copper, gold, silver, etc. More specifically, thedisclosed precursor compounds utilize pentadienyl ligands coupled to ametal (e.g. copper, gold, silver) to increase thermal stability.Furthermore, methods of depositing copper, gold, or silver are disclosedin conjunction with use of other precursors to deposit metal films. Themethods and compositions may be used in a variety of depositionprocesses. The disclosed compounds have several advantages such thermalstability at room temperatures. In addition, the disclosed precursors donot contain toxic phosphorous compounds. Other aspects of the methodsand compositions will be described in more detail below.

In an embodiment, a method for depositing a metal film on to one or moresubstrates comprises providing one or more substrates in a reactionchamber. The method further comprises introducing a first precursor intothe reaction chamber, wherein the first precursor comprises anorganometallic compound having the formula: (Op)_(x)(Cp)_(y)MR′_(2-x-y).M is a group 11 metal. Op is an open-pentadienyl group, Cp is acyclopentadienyl group, R′ is selected from the group consisting of a C1to C12 alkyl group, a trialkylsilyl group, an alkylamide group, analkoxide group, an alkylsilyl group, an alkylsilylamide group, anamidinate group, CO, SMe₂, SEt₂, SiPr₂, SMeEt, SMe(iPr), SEt(iPr), OMe₂,OEt₂, tetrahydrofuran (THF), and combinations thereof. The Op and Cpgroups may comprise functional groups selected from the group consistingof a hydrogen group, a halogen group, a C1-C4 alkyl group, an alkylamidegroup, an alkoxide group, an alkylsilylamide group, an amidinate group,a carbonyl group, and combinations thereof. The subscript “x” is aninteger ranging from 0 to 1 and the subscript “y” is an integer rangingfrom 0 to 1. The method also comprises vaporizing the first precursor todeposit the metal film on to the one or more substrates.

In an embodiment, a precursor for depositing a metal film on to one ormore substrates comprises an organometallic compound having the formula:(Op)_(x)(Cp)_(y)MR′_(2-x-y)where M is a group 11 metal, Op is an open-pentadienyl group, Cp is acyclopentadienyl group, R′ is selected from the group consisting of a C1to C12 alkyl group, a trialkylsilyl group, an alkylamide group, analkoxide group, an alkylsilyl group, an alkylsilylamide group, anamidinate group, CO, SMe₂, SEt₂, SiPr₂, SMeEt, SMe(iPr), SEt(iPr), OMe₂,OEt₂, tetrahydrofuran (THF), and combinations thereof. The Op and Cpgroups may comprise functional groups selected from the group consistingof a hydrogen group, a halogen group, a C1-C4 alkyl group, an alkylamidegroup, an alkoxide group, an alkylsilylamide group, an amidinate group,a carbonyl group, and combinations thereof. The subscript x is aninteger ranging from 0 to 1 and the subscript y is an integer rangingfrom 0 to 1.

The foregoing has outlined rather broadly the features and technicaladvantages of the present invention in order that the detaileddescription of the invention that follows may be better understood.Additional features and advantages of the invention will be describedhereinafter that form the subject of the claims of the invention. Itshould be appreciated by those skilled in the art that the conceptionand the specific embodiments disclosed may be readily utilized as abasis for modifying or designing other structures for carrying out thesame purposes of the present invention. It should also be realized bythose skilled in the art that such equivalent constructions do notdepart from the spirit and scope of the invention as set forth in theappended claims.

Notation and Nomenclature

Certain terms are used throughout the following description and claimsto refer to particular system components. This document does not intendto distinguish between components that differ in name but not function.

In the following discussion and in the claims, the terms “including” and“comprising” are used in an open-ended fashion, and thus should beinterpreted to mean “including, but not limited to . . . ”. Also, theterm “couple” or “couples” is intended to mean either an indirect ordirect chemical bond. Thus, if a first molecule couples to a secondmolecule, that connection may be through a direct bond, or through anindirect bond via other functional groups or bonds. The bonds may be anyknown chemical bonds such as without limitation, covalent, ionic,electrostatic, dipole-dipole, etc.

As used herein, the term “alkyl group” refers to saturated functionalgroups containing exclusively carbon and hydrogen atoms. Further, theterm “alkyl group” refers to linear, branched, or cyclic alkyl groups.Examples of linear alkyl groups include without limitation, methylgroups, ethyl groups, propyl groups, butyl groups, etc. Examples ofbranched alkyls groups include without limitation, t-butyl. Examples ofcyclic alkyl groups include without limitation, cyclopropyl groups,cyclopentyl groups, cyclohexyl groups, etc.

As used herein, the abbreviation, “Me,” refers to a methyl group; theabbreviation, “Et,” refers to an ethyl group; the abbreviation, “Pr,”refers to a propyl group; and the abbreviation, “iPr,” refers to anisopropyl group.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

In an embodiment, a precursor for the deposition of a metal filmcomprises an organometallic compound having the formula:(Op)_(x)(Cp)_(y)MR′_(2-x-y). As used herein, the term “organometallic”may refer to compounds or molecules that contain a metal-carbon bond. Mmay be any suitable metal. In particular, M may include any Group 11metal such as without limitation, copper (Cu), silver (Ag) or gold (Au).Other suitable metals include ruthenium or tantalum. Op is a substitutedor an unsubstituted open-pentadienyl ligand. Furthermore, Cp is acyclopentadienyl ligand, which also may be substituted or unsubstituted.The subscript, x, is an integer representing the number of Op ligands,ranging from 0 to 1. The subscript y, is an integer representing thenumber of Cp ligands, ranging from 0 to 1.

The R′ substituent may be a functional group providing an even number ofπ electrons. Specifically, R′ may be a C1 to C12 linear or branchedalkyl group. Additionally, R′ may comprise trialkylsilyl groups, alkylgroups, alkylamide groups, alkoxide groups, alkylsilyl group,alkylsilylamide groups, amidinate groups, CO, SiMe₂, SiEt₂, SiPr₂,SiMeEt, SiMe(iPr), SiEt(iPr), OMe₂, OEt₂, tetrahydrofuran (THF), orcombinations thereof. In embodiments where the organometallic compoundcomprises more than one R′ groups, each R′ group coupled to M may be thesame or different from one another. In an exemplary embodiment, R′ isbis((trimethylsilyl)acetylene. Other examples of suitable R′ groupsinclude without limitation, butadiene, butane, acetylene,cyclohexadiene, trimethylsilylacetylene, cyclohexa-1,4-diene, propylene,ethylene, etc.

According to one embodiment, the Cp ligand may have the followingformula:

Alternatively, the Cp ligand may be represented by the formula: CpR¹⁻⁵.R¹-R⁵ may each independently be a hydrogen group, a halogen group (e.g.Cl, Br, etc.), a C1-C4 linear or branched alkyl group, an alkylamidegroup, an alkoxide group, an alkylsilylamide group, an amidinate group,a carbonyl group, or combinations thereof. R¹⁻⁵ may be the same ordifferent from one another. Examples of suitable Cp ligands includewithout limitation, methylcyclopentadiene, ethylcyclopentadiene,isopropylcyclopentadiene, and combinations thereof. In at least oneembodiment, at least 4 of R¹⁻⁵ in the Cp ligand shown in formula (1) arehydrogen groups (i.e. unsubstituted).

In an embodiment, the Op ligand may have the following formula:

The Op ligand may alternatively be represented by the formula: OpR¹⁻⁷.R¹-R⁷ may each independently be a hydrogen group, a halogen group (e.g.Cl, Br, etc.), a C1-C4 linear or branched alkyl group, an alkylamidegroup, an alkoxide group, an alkylsilylamide group, an amidinate group,a carbonyl group, or combinations thereof. R¹⁻⁷ may be the same ordifferent from one another. Examples of Op ligands include withoutlimitation, 1,3-pentadiene, 1,4-pentadiene, 3-methyl-1,3-pentadiene,3-methyl-1,4-pentadiene, 2,4-dimethyl-1,3-pentadiene,2,4-dimethyl-1,4-pentadiene, 3-ethyl-1,3-pentadiene,1,5-bistrimethoxysilyl-1,3-pentadiene, and1,5-bistrimethoxysilyl-1,4-pentadiene and combinations thereof. In atleast one embodiment, at least 5 of R¹⁻⁷ in the Op ligand shown informula (2) are hydrogen groups (i.e. unsubstituted).

In one embodiment, the precursor may be an organometallic compoundhaving the formula:

In this embodiment, y equals 0. That is, the organometallic compoundcomprises only an open pentadienyl ligand and the R′ ligand.Furthermore, in at least one embodiment, at least 5 of R¹⁻⁷ are hydrogengroups. In other words, besides the MR′ functional group, the Op grouphas two substituents. The two substituents preferably are a methyl orethyl group. In at least one embodiment, the precursor has the formulashown in (3) where R′ is bis((trimethylsilyl)acetylene.

In one embodiment, the precursor may be an organometallic compoundhaving the formula:

In this embodiment, x equals 0. That is, the organometallic compoundcomprises only a cyclopentadienyl ligand and the R′ ligand. Furthermore,in at least one embodiment, at least 4 of R¹⁻⁵ are hydrogen groups. Thatis, besides the MR′ functional group, the Cp group has only a singlesubstituent. The single substituent preferably is a methyl or ethylgroup. In at least one embodiment, the precursor has the formula shownin (4) where R′ is bis((trimethylsilyl)acetylene.

Generally, the disclosed metal precursors have a low melting point. Inat least one embodiment, the metal precursor is liquid at roomtemperature (e.g. ˜25° C.). Specifically, embodiments of the precursorsmay have melting points less than about 50° C., alternatively less thanabout 40° C., alternatively less than about 35° C.

Examples of the disclosed precursors containing Cu include withoutlimitation, CuCp(ethylene), Cu(MeCp)(ethylene), Cu(EtCp)(ethylene),Cu(iPrCp)(ethylene), CuCp(propy-lene), Cu(MeCp)(propylene),Cu(EtCp)(propylene), Cu(iPrCp)(propylene), CuCp(1-butene),Cu(MeCp)(1-butene), Cu(EtCp)(1-butene), Cu(iPrCp)(2-butene),CuCp(2-butene), Cu(MeCp)(2-butene), Cu(EtCp)(2-butene),Cu(iPrCp)(2-butene), CuCp(butadiene), Cu(MeCp)(butadiene),Cu(EtCp)(butadiene), Cu(iPrCp)(butadiene), CuCp(cyclobutadiene),Cu(MeCp)(cyclobutadiene), Cu(EtCp)(cyclobutadiene),Cu(iPrCp)(cyclobutadiene), CuCp(cyclohexa-1,3-ene),Cu(MeCp)(cyclohexa-1,3-diene), Cu(EtCp)(cyclohexa-1,3-diene),Cu(iPrCp)(cyclohexa-1,3-diene), CuCp(cyclohexa-1,4-diene),Cu(MeCp)(cyclohexa-1,4-diene), Cu(EtCp)(cyclohexa-1,4-diene),Cu(iPrCp)(cyclohexa-1,4-diene), CuCp(acetylene), Cu(MeCp)(acetylene),Cu(EtCp)(acetylene), Cu(iPrCp)(acetylene),CuCp(trimethylsilylacetylene), Cu(MeCp)(trimethylsilyl acetylene),Cu(EtCp)(trimethylsilylacetylene), Cu(iPrCp)(trimethylsilylacetylene),CuCp (bis(trimethylsilyl)acetylene), Cu(MeCp)(trimethylsilylacetylene),Cu(EtCp)(bis(trimethylsilyl)acetylene),Cu(iPrCp)(bis(trimethylsilyl)acetylene), CuCp(ethylene),Cu(MeCp)(ethylene), Cu(EtCp)(ethylene), Cu(iPrCp)(ethylene),CuCp(trimethylvinylsilane), Cu(MeCp)(trimethylvinylsilane),Cu(EtCp)(trimethylvinylsilane), Cu(iPrCp)(trimethylvinylsilane),CuCp(bis(trimethylsilyl)acetylene),Cu(MeCp)(bis(trimethylsilyl)ethylene),Cu(EtCp)(bis(trimethylsilyl)ethylene),Cu(iPrCp)(bis(trimethylsilyl)ethylene),Cu(2,4-dimethylpentadienyl)(ethylene),Cu(2,4-dimethylpentadienyl)(propylene),Cu(2,4-dimethylpentadienyl)(1-butylene),Cu(2,4-dimethylpentadienyl)(2-butylene),Cu(2,4-dimethylpentadienyl)(butadiene), Cu(2,4-dimethylpentadienyl)(cyclobutadiene),Cu(2,4-dimethylpentadienyl)(cyclohexa-1,3-diene), Cu(2,4-dimethylpentadienyl)(cyclohexa-1,4-diene),Cu(2,4-dimethylpentadienyl)(acetylene),Cu(2,4-dimethylpentadienyl)(trimethylsilylacetylene),Cu(2,4-dimethylpentadienyl)(bis(trimethylsilyl)acetylene), orcombinations thereof.

Examples of the disclosed precursors containing Ag include withoutlimitation, AgCp(ethylene), Ag(MeCp)(ethylene), Ag(EtCp)(ethylene),Ag(iPrCp)(ethylene), AgCp (propylene), Ag(MeCp)(propylene),Ag(EtCp)(propylene), Ag(iPrCp)(propylene), AgCp(1-butene),Ag(MeCp)(1-butene), Ag(EtCp)(1-butene), Ag(iPrCp)(2-butene),AgCp(2-butene), Ag (MeCp)(2-butene), Ag(EtCp)(2-butene),Ag(iPrCp)(2-butaene), AgCp(butadiene), Ag(MeCp)(butadiene),Ag(EtCp)(butadiene), Ag(iPrCp)(butadiene), AgCp(cyclobutadiene),Ag(MeCp)(cyclobutadiene), Ag(EtCp)(cyclobutadiene),Ag(iPrCp)(cyclobutadiene), AgCp(cyclohexa-1,3-diene),Ag(MeCp)(cyclohexa-1,3-diene), Ag(EtCp)(cyclohexa-1,3-diene),Ag(iPrCp)(cyclohexa-1,3-diene), AgCp(cyclohexa-1,4-diene),Ag(MeCp)(cyclohexa-1,4-diene), Ag(EtCp)(cyclohexa-1,4-diene),Ag(iPrCp)(cyclohexa-1,4-diene), AgCp(acetylene), Ag(MeCp)(acetylene),Ag(EtCp)(acetylene), Ag(iPrCp)(acetylene),AgCp(trimethylsilylacetylene), Ag(MeCp)(trimethylsilylacetylene),Ag(EtCp)(trimethylsilylacetylene), Ag(iPrCp)(trimethylsilylacetylene),AgCp(bis(trimethylsilyl)acetylene),Ag(MeCp)(bis(trimethylsilyl)ethylene),Ag(EtCp)(bis(trimethylsilyl)acetylene),Ag(iPrCp)(bis(trimethylsilyl)acetylene), AgCp(trimethylvinyl silane),Ag(MeCp)(trimethylvinylsilane), Ag(EtCp)(trimethylvinylsilane),Ag(iPrCp)(trimethylvinylsilane), AgCp(bis(trimethylsilyl)acetylene),Ag(MeCp)(bis(trimethylsilyl)ethylene),Ag(EtCp)(bis(trimethylsilyl)ethylene),Ag(iPrCp)(bis(trimethylsilyl)ethylene),Ag(2,4-dimethylpentadienyl)(ethylene),Ag(2,4-dimethylpentadienyl)(propylene), Ag(2,4-dimethylpentadienyl)(1-butylene), Ag(2,4-dimethylpentadienyl)(2-butylene),Ag(2,4-dimethylpentadienyl)(butadiene),Ag(2,4-dimethylpentadienyl)(cyclobutadiene),Ag(2,4-dimethylpentadienyl)(cyclohexadi-1,3-ene),Ag(2,4-dimethylpentadienyl)(cyclohexadi-1,4-ene),Ag(2,4-dimethylpentadienyl)(acetylene),Ag(2,4-dimethylpentadienyl)(trimethylsilylacetylene), Ag(2,4-dimethylpentadienyl)(bis(trimethylsilyl)acetylene), or combinations thereof.

Examples of the disclosed precursors containing Au include withoutlimitation, AuCp(ethylene), Au(MeCp)(ethylene), Au(EtCp)(ethylene),Au(iPrCp)(ethylene), AuCp(propylene), Au(MeCp)(propylene),Au(EtCp)(propylene), Au(iPrCp)(propylene), AuCp(1-butene),Au(MeCp)(1-butene), Au(EtCp)(1-butene), Au(iPrCp)(2-butene),AuCp(2-butene), Au(MeCp)(2-butene), Au(EtCp)(2-butene),Au(iPrCp)(2-butene), AuCp(butadiene), Au(MeCp)(butadiene),Au(EtCp)(butadiene), Au(iPrCp)(butadiene), AuCp(cyclobutadiene),Au(MeCp)(cyclobutadiene), Au(EtCp)(cyclobutadiene),Au(iPrCp)(cyclobutadiene), AuCp (cyclohexa-1,3-diene),Au(MeCp)(cyclohexa-1,3-diene), Au(EtCp)(cyclohexa-1,3-diene), Au(iPrCp)(cyclohexa-1,3-diene), AuCp(cyclohexa-1,4-diene),Au(MeCp)(cyclohexa-1,4-diene), Au(EtCp)(cyclohexa-1,4-diene),Au(iPrCp)(cyclohexa-1,4-diene), AuCp(acetylene), Au(MeCp)(acetylene),Au(EtCp)(acetylene), Au(iPrCp)(acetylene),AuCp(trimethylsilylacetylene), Au (MeCp)(trimethylsilylacetylene),Au(EtCp)(trimethylsilylacetylene), Au(iPrCp)(trimethylsilyl acetylene),AuCp(bis(trimethylsilyl)acetylene),Au(MeCp)(bis(trimethylsilyl)ethylene),Au(EtCp)(bis(trimethylsilyl)acetylene),Au(iPrCp)(bis(trimethylsilyl)acetylene), AuCp(trimethylvinyl silane),Au(MeCp)(trimethylvinylsilane), Au(EtCp)(trimethylvinylsilane),Au(iPrCp) (trimethylvinylsilane), AuCp(bis(trimethylsilyl)acetylene),Au(MeCp)(bis(trimethylsilyl)ethylene),Au(EtCp)(bis(trimethylsilyl)ethylene),Au(iPrCp)(bis(trimethylsilyl)ethylene), Au(2,4-dimethylpentadienyl)(ethylene), Au(2,4-dimethylpentadienyl)(propylene),Au(2,4-dimethylpentadienyl)(1-butylene),Au(2,4-dimethylpentadienyl)(2-butylene),Au(2,4-dimethylpentadienyl)(butadiene),Au(2,4-dimethylpentadienyl)(cyclobutadiene),Au(2,4-dimethylpentadienyl)(cyclohexadi-1,3-ene),Au(2,4-dimethylpentadienyl)(cyclohexadi-1,4-ene),Au(2,4-dimethylpentadienyl)(acetylene),Au(2,4-dimethylpentadienyl)(trimethylsilylacetylene),Au(2,4-dimethylpentadienyl)(bis(trimethyl silyl)acetylene), orcombinations thereof.

The disclosed precursor compounds may be deposited using any depositionmethods known to those of skill in the art. Examples of suitabledeposition methods include without limitation, conventional CVD, lowpressure chemical vapor deposition (LPCVD), atomic layer deposition(ALD), pulsed chemical vapor deposition (P-CVD), plasma enhanced atomiclayer deposition (PE-ALD), or combinations thereof. In an embodiment, afirst precursor may be introduced into a reaction chamber. The reactionchamber may be any enclosure or chamber within a device in whichdeposition methods take place such as without limitation, a cold-walltype reactor, a hot-wall type reactor, a single-wafer reactor, amulti-wafer reactor, or other types of deposition systems underconditions suitable to cause the precursors to react and form thelayers. The first precursor may be introduced into the reaction chamberby bubbling an inert gas (e.g. N₂, He, Ar, etc.) into the precursor andproviding the inert gas plus precursor mixture to the reactor.

Generally, the reaction chamber contains one or more substrates on towhich the metal layers or films will be deposited. The one or moresubstrates may be any suitable substrate used in semiconductormanufacturing. Examples of suitable substrates include withoutlimitation, silicon substrates, silica substrates, silicon nitridesubstrates, silicon oxy nitride substrates, tungsten substrates, orcombinations thereof. Additionally, substrates comprising tungsten ornoble metals (e.g. platinum, palladium, rhodium or gold) may be used.

In an embodiment, a method of depositing a metal film on substrate mayfurther comprise introducing a second precursor into the reactionchamber. The second precursor may be a metal precursor containing one ormore metals other than a Group 11 metal. For example, the secondprecursor may include without limitation, Mg, Ca, Zn, B, Al, In, Si, Ge,Sn, Ti, Zr, Hf, V, Nb, Ta, or combinations thereof. Other examples ofmetals include rare earth metals and lanthanides. The second precursormay contain silicon and/or germanium. In particular, examples ofsuitable second metal precursors include without limitation,trisilylamine, silane, disilane, trisilane,bis(tertiary-butylamino)silane (BTBAS), bis(diethylamino)silane (BDEAS),or combinations thereof. In addition, the second metal precursor may bean aminosilane having the formula: SiH_(x)(NR¹R²)_(4-x). The subscript,x, is an integer between 0 and 4. R¹ and R² may each independently be ahydrogen group or a C1-C6 alkyl group, either linear, branched, orcyclic. R¹ and R² may be the same or different from on another. In oneembodiment, the second metal precursor is tris(diethylamino)silane(TriDMAS).

In an alternative embodiment, the second precursor may be an aluminumsource. Examples of suitable aluminum sources include withoutlimitation, trimethylaluminum, dimethylaluminum hydride, or combinationsthereof. Additionally, the aluminum source may be an amidoalane havingthe formula: AlR¹ _(x)(NR²R³)_(3-x). The subscript, x, is an integerfrom 0 and 3. R¹, R² and R³ may each independently be a hydrogen groupor a C1-C6 carbon chain, either linear, branched or cyclic and may eachbe the same or different from on another.

In another embodiment, the second precursor may be a tantalum and/orniobium source selected from the group comprising MCl₅ and correspondingadducts, M(NMe₂)₅, M(NEt₂)₄, M(NEt₂)₅, or combinations thereof. Mrepresents either tantalum or niobium. Furthermore, the tantalum and/orniobium source may be an amino-containing tantalum and/or niobium sourcehaving the formula: M(═NR¹)(NR²R³)₃. R¹, R², and R³ may eachindependently be a hydrogen group or a C1-C6 alkyl group, either linear,branched, or cyclic. Generally, the weight ratio of the first metalprecursor to the cobalt precursor introduced into the reaction chambermay range from about 100:1 to about 1:100, alternatively from about 50:1to about 1:50, alternatively from about 1:1 to about 10:1.

In embodiments, the reaction chamber may be maintained at a pressureranging from about 1 Pa to about 100,000 Pa, alternatively from about 10Pa to about 10,000 Pa, alternatively from about 25 Pa to about 1000 Pa.In addition, the temperature within the reaction chamber may range fromabout 100° C. to about 500° C., alternatively from about 120° C. toabout 450° C., alternatively from about 150° C. to about 350° C.Furthermore, the deposition of the metal film may take place in thepresence of a hydrogen source. Thus, a hydrogen source may be introducedinto the reaction chamber. The hydrogen source may be a fluid or a gas.Examples of suitable hydrogen sources include without limitation, H₂,H₂O, H₂O₂, N₂, NH₃, hydrazine and its alkyl or aryl derivatives,diethylsilane, trisilylamine, silane, disilane, phenylsilane and anymolecule containing Si—H bonds, dimethylaluminum hydride,hydrogen-containing radicals such as H., OH., N., NH., NH₂., orcombinations thereof. In further embodiments, an inert gas may beintroduced into the reaction chamber. Examples of inert gases includewithout limitation, He, Ar, Ne, or combinations thereof. A reducingfluid may also be introduced in to the reaction chamber. Examples ofsuitable reducing fluids include without limitation, carbon monoxide,Si₂Cl₆, or combinations thereof.

The metal precursors may be introduced sequentially (as in ALD) orsimultaneously (as in CVD) into the reaction chamber. In one embodiment,the first and second precursors may be pulsed sequentially orsimultaneously (e.g. pulsed CVD) into the reaction chamber while theoxidizing or nitridizing gas is introduced continuously into thereaction chamber. Each pulse of the cobalt and/or first metal precursormay last for a time period ranging from about 0.01 s to about 10 s,alternatively from about 0.3 s to about 3 s, alternatively from about0.5 s to about 2 s. In another embodiment, the reaction fluid, and/orthe inert gas may also be pulsed into the reaction chamber. In suchembodiments, the pulse of each gas may last for a time period rangingfrom about 0.01 s to about 10 s, alternatively from about 0.3 s to about3 s, alternatively from about 0.5 s to about 2 s.

While embodiments of the invention have been shown and described,modifications thereof can be made by one skilled in the art withoutdeparting from the spirit and teachings of the invention. Theembodiments described and the examples provided herein are exemplaryonly, and are not intended to be limiting. Many variations andmodifications of the invention disclosed herein are possible and arewithin the scope of the invention. Accordingly, the scope of protectionis not limited by the description set out above, but is only limited bythe claims which follow, that scope including all equivalents of thesubject matter of the claims.

The discussion of a reference is not an admission that it is prior artto the present invention, especially any reference that may have apublication date after the priority date of this application. Thedisclosures of all patents, patent applications, and publications citedherein are hereby incorporated herein by reference in their entirety, tothe extent that they provide exemplary, procedural, or other detailssupplementary to those set forth herein.

1. A method for depositing a metal film on to one or more substratescomprising: a) providing one or more substrates in a reaction chamber;b) introducing a first precursor into the reaction chamber, wherein thefirst precursor comprises an organometallic compound having the formula:(Op)_(x)(Cp)_(y)MR′_(2-x-y) wherein M is a group 11 metal, Op is anopen-pentadienyl group, Cp is a cyclopentadienyl group, R′ is selectedfrom the group consisting of a C1 to C12 alkyl group, a triakylsilylgroup, an alkylamide group, an alkoxide group, an alkylsilyl group, analkylsilylamide group, an amidinate group, CO, SMe₂, SEt₂, SiPr₂,SiMeEt, SiMe(iPr), SiEt(iPr), OMe₂, OEt₂, tetrahydrofuran (THF), andcombinations thereof, wherein Op and Cp may each comprise functionalgroups selected from the group consisting of a hydrogen group, a halogengroup, a C1-C4 alkyl group, an alkylamide group, an alkoxide group, analkylsilylamide group, an amidinate group, a carbonyl group, andcombinations thereof, and wherein x equals 1 and y equals 0; and c)vaporizing the first precursor to deposit the metal film on to the oneor more substrates.
 2. The method of claim 1 wherein M is gold, silver,or copper.
 3. The method of claim 1 wherein the first precursor isliquid at room temperature.
 4. The method of claim 1 wherein the firstprecursor has the formula:

wherein at least 5 of R¹⁻⁷ are hydrogen groups, wherein two of R¹⁻⁷comprises a methyl group or an ethyl group.
 5. The method of claim 1wherein the first precursor comprisesM(2,4-dimethylpentadienyl)(ethylene),M(2,4-dimethylpentadienyl)(propylene), M(2,4-dimethylpentadienyl)(1-butylene), M(2,4-dimethylpentadienyl)(2-butylene),M(2,4-dimethylpentadienyl) (butadiene),M(2,4-dimethylpentadienyl)(cyclobutadiene), M(2,4-dimethylpentadienyl)(cyclohexadi-1,3-ene), M(2,4-dimethylpentadienyl)(cyclohexadi-1,4-ene),M(2,4-dimethyl pentadienyl)(acetylene),M(2,4-dimethylpentadienyl)(trimethylsilylacetylene), M(2,4-dimethylpentadienyl)(bis(trimethylsilyl)acetylene), or combinations thereof,wherein M is Au, Ag, or Cu.
 6. The method of claim 1 wherein the one ormore substrates comprise silicon, silica, silicon nitride, silicon oxynitride, tungsten, or combinations thereof.
 7. The method of claim 1wherein the reaction chamber is at a temperature ranging from about 150°C. to about 350° C. in (c).
 8. The method of claim 1 wherein thereaction chamber is at a pressure ranging from about 1 Pa to about 1,000Pa in (c).
 9. The method of claim 1, further comprising introducinghydrogen source, a reducing fluid, an inert gas, or combinations thereofinto the reaction chamber.
 10. The method of claim 9 wherein thehydrogen source comprises H₂, H₂O, H₂O₂, N₂, NH₃, hydrazine and itsalkyl or aryl derivatives, diethylsilane, trisilylamine, silane,disilane, phenylsilane, dimethylaluminum hydride, H. radicals, OH.radicals, NH. radical, NH₂. radicals, or combinations thereof.
 11. Themethod of claim 9 wherein the reducing fluid comprises carbon monoxide,Si₂Cl₆, or combinations thereof.
 12. The method of claim 1, furthercomprising introducing a second precursor into the reaction chamber. 13.The method of claim 12, wherein the second precursor comprises Mg, Ca,Zn, B, Al, In, Si, Ge, Sn, Ti, Zr, Hf, V, Nb, Ta, a lanthanide, a rareearth metal, or combinations thereof.
 14. The method of claim 12,wherein the second precursor comprises trisilylamine, silane, disilane,trisilane, bis(tertiary-butylamino)silane (BTBAS),bis(diethylamino)silane (BDEAS), an aminosilane having the formula:Si_(x)(NR¹R²)_(4-x), wherein x is an integer between 0 and 4, R¹ and R²may each independently be a hydrogen group or a C1-C6 alkyl group, andwherein R¹ and R² may be the same or different from on another, orcombinations thereof.
 15. The method of claim 12, wherein introducingthe first precursor and the second precursor into the reaction chamberoccurs simultaneously.
 16. The method of claim 12, wherein introducingthe first precursor and the second precursor into the reaction chamberoccurs sequentially.
 17. The method of claim 12, wherein introducing thefirst precursor and the second precursor into the reaction chambercomprises pulsing the first precursor and the second precursor into thereaction chamber.
 18. The method of claim 12, wherein the secondprecursor is an aluminum source.
 19. The method of claim 18 wherein thealuminum source comprises trimethylaluminum, dimethylaluminum hydride, acompound have the formula:AlR¹ _(x)(NR²R³)_(3-x) wherein x is an integer from 0 and 3, R¹, R², andR³ may each independently be a hydrogen group or a C1-C6 alkyl group andR¹, R², and R³ may each be the same or different from on another, orcombinations thereof.
 20. The method of claim 12, wherein the secondprecursor comprises a tantalum source or a niobium source.
 21. Themethod of claim 20 wherein the tantalum source or niobium sourcecomprises one or more compounds having the following formulas: MCl₅,M(NMe₂)₅, M(NEt₂)₄, M(NEt₂)₅, M(═NR¹)(NR²R³)₃, wherein R¹, R², and R³may each independently be a hydrogen group or a C1-C6 alkyl group, andwherein R¹, R², and R³ may be the same or different from one another,wherein M is tantalum or niobium.
 22. A precursor for depositing a metalfilm on to a substrate comprising: an organometallic compound having theformula:(Op)_(x)(Cp)_(y)MR′_(2-x-y) wherein M is a group 11 metal, Op is anopen-pentadienyl group, Cp is a cyclopentadienyl group, R′ is selectedfrom the group consisting of a C1 to C12 alkyl group, a trialkylsilylgroup, an alkylamide group, an alkoxide group, an alkylsilyl group, analkylsilylamide group, an amidinate group, CO, SiMe₂, SiEt₂, SiPr₂,SiMeEt, SiMe(iPr), SiEt(iPr), OMe₂, OEt₂, tetrahydrofuran (THF), andcombinations thereof, wherein Op and Cp may each comprise functionalgroups selected from the group consisting of a hydrogen group, a halogengroup, a C1-C4 alkyl group, an alkylamide group, an alkoxide group, analkylsilylamide group, an amidinate group, a carbonyl group, andcombinations thereof, and wherein x equals 1 and y equals
 0. 23. Theprecursor of claim 22 wherein M is copper, gold, or silver.
 24. Theprecursor of claim 22 wherein Op has the formula: OpR¹⁻⁷, wherein R¹-R⁷may each independently be a hydrogen group, a halogen group, a C1-C4alkyl group, an alkylamide group, an alkoxide group, an alkylsilylamidegroup, an amidinate group, a carbonyl group, or combinations thereof,and wherein R¹⁻⁷ may be the same or different from one another.
 25. Theprecursor of claim 22 wherein R′ is bis(trimethylsilyl)acetylene. 26.The precursor of claim 22 wherein R′ comprises trialkylsilyl groups,alkyl groups, alkylamide groups, alkoxide groups, alkylsilyl group,alkylsilylamidegroups, amidinate groups, CO, SiMe₂, SiEt₂, SiPr₂,SiMeEt, SiMe(iPr), SiEt(iPr), OMe₂, OEt₂, tetrahydrofuran (THE), orcombinations thereof.
 27. The precursor of claim 22 wherein R′ comprisesbutadiene, butane, acetylene, cyclohexadiene, trimethylsilylacetylene,cyclohexa-1,4-diene, propylene, or ethylene.
 28. The precursor of claim22 wherein the organometallic compound has a melting point less thanabout 35° C.